HDI PCB (High Density Interconnect)

Product Detail

HDI PCB (High Density Interconnect)

HDI is an abbreviation of High Density Interconnector. It is a kind of technology (technical) for producing printed boards, and a circuit board with a relatively high density of wiring distribution using the micro blind buried hole technology. HDI is a compact product designed for small capacity users. It adopts a modular and parallel design, a module capacity of 1000VA (1U in height), natural cooling, can be directly placed into a 19” rack, and can be connected in parallel to a maximum of 6 modules. This product uses all-digital signal process control (DSP) technology and many The patented technology has a full range of adaptability to load and a strong short-term overload capability, regardless of load power factor and crest factor.




HDI circuit advantages


1 Reduces PCB cost: When the density of the PCB increases more than eight layers, manufacturing with HDI will cost less than the traditional 2 complex lamination process.

3 Increase the line density: the interconnection of traditional circuit boards and parts

4 conducive to the use of advanced packaging technology                                 

5 has better electrical performance and signal correctness

6 Better reliability

7 can improve thermal properties

8 Improves RF/Electromagnetic/Electrostatic Discharge (RFI/EMI/ESD)

9 Increase design efficiency [1]




The HDI PCBs we offer include the following highly requested characteristics:


• Blind and/or buried vias

• Via-in-pad

• Through vias from surface to surface

• 20 µm circuit geometries

• 30 µm dielectric layers

• 50 µm laser vias

• 125 µm bump pitch processing

Our high density circuit boards have the technology-pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.


JIA-Speed can provide you with the highest quality HDI PCB, please do not hesitate to contact us TEL: +8613186089157




HDI PCB board stack structure













         Blind hole, through hole, without buried hole






















   

                                 




     





            With Blind hole, through hole and buried hole  



















 6-layer HDI PCB (1+4+1 layer)                




  

              

 








            Blind hole, through hole, without buried hole 
















           

       

                







          With Blind hole, through hole and buried hole



















8-layer HDI PCB (1+4+1 layer)

                                                                                            

           







            Blind hole, through hole, without buried hole 












           




           With Blind hole, through hole and buried hole











HDI PCB second-order blind hole




HDI PCB second-order blind hole: the blind hole that leads from the outer layer to the third layer can be directly turned on 1-3 layers, and can also be turned on 1-2 layers, 2-3 layers( 1+1+4+1+1 layer)






HDI PCB Second Order Blind Hole (1+6+1 layer)









HDI PCB capabilities




Feature	Capability
Quality Grade	Standard IPC 2
Layers	4 - 24layers
Build Time	2days - 5weeks
Material	FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination
Board Size	Min 6*6mm | Max 457*610mm
Board Thickness	0.4mm - 3.0mm
Copper Weight (Finished)	0.5oz - 2.0oz
Min Tracing/Spacing	2.5mil/2.5mil
Solder Mask Sides	As per the file
Solder Mask Color	Green, White, Blue, Black, Red, Yellow
Silkscreen Sides	As per the file
Silkscreen Color	White, Black, Yellow
Surface Finish	HASL - Hot Air Solder Leveling  Lead Free HASL - RoHS  ENIG - Electroless Nickle/Immersion Gold - RoHS  Immersion Silver - RoHS  Immersion Tin - RoHS  OSP - Organic Solderability Preservatives - RoHS
Min Annular Ring	4mil, 3mil - laser drill
Min Drilling Hole Diameter	6mil, 4mil - laser drill
Max Exponents of Blind/Buried Vias	stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected
Other Techniques	Flex-rigid combination  Via In Pad  Buried Capacitor (only for Prototype PCB total area =1m²)




Xi'an JIA-SPEED Electronic Technology Co., Ltd. can provide you with customized HDI PCB according to your requirements. Please send your PCB geber file to emal : jiaspeed243@yahoo.com, or directly call  USD : +8613186089157, us Will provide you with detailed quote within 2 hours